Dealing with the design and development of back-end and packaging –in collaboration with the corresponding technological platform of INPHOTEC- for components in the fields of photonics, optoelectronics, MOEMS and sensors, with application in telecom, datacom, biotechnology, medical, terrestrial and space applications. A complete pilot line is available that can run up to thousands pieces/year for PICs, starting from dicing up to the final packaged product, including automated wire bonding, die attachment, flip chip and pigtailing processes. Pigtailing bench is unique in Europe for automated and robotized fiber array and lenses pigtailing with silicon photonics devices.